High Frequency Isola Printed Circuit Board Thermal Conductivity of Fr4 PCB

High Frequency Isola Printed Circuit Board Thermal Conductivity of Fr4 PCB

Material:Isola Fr406

Layer:2

Thickness: 1.6mm

Surface finish: ENIG

Soldermask: Green

Product Features

· Industry Recognition

- RoHS Compliant

· Performance Attributes

- Lead-free assembly compatible

· Processing Advantages

- FR-4 process compatible

- UV blocking and AOI fluorescence

Product Availability

· Standard Material Offering: Laminate

- Available in full size sheet or panel form

· Copper Foil Type

- VLP-2 (2 micron), 1 oz and below

· Copper Weight

- ½ to 2 oz (18 to 70 μm) available

- Heavier copper available

- Thinner copper foil available

· Standard Material Offering: Prepreg

- Roll or panel form

- Tooling of prepreg panels

· Glass Fabric Availability

- E-glass

- Square weave glass

- Mechanically spread glass